Opening in the Pad for Bonding Integrated Passive Device in InFO Package
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsCheng-Hsien Hsieh, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen, Li-Han Hsu, Wei-Cheng Wu
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Abstract
A package includes a conductive pad, with a plurality of openings penetrating through the conductive pad. A dielectric layer encircles the conductive pad. The dielectric layer has portions filling the plurality of openings. An Under-Bump Metallurgy (UBM) includes a via portion extending into the dielectric layer to contact the conductive pad. A solder region is overlying and contacting the UBM. An integrated passive device is bonded to the UBM through the solder region.
Claims20
A package of integrated circuit device, the package comprising:
- a device die;
- a through-via;
- an encapsulating material encapsulating the device die and the through-via therein;
- a plurality of redistribution lines over the encapsulating material and electrically coupling to the device die and the through-via, wherein the plurality of redistribution lines comprise a first metal pad and a second metal pad;
- an integrated passive device comprising a first terminal and a second terminal, wherein the first terminal overlaps a portion of, and is electrically coupled to, the first metal pad and the second metal pad;
- and
- a polymer layer comprising a plurality of portions extending into the first metal pad, wherein the plurality of portions of the polymer layer are separated from each other by the first metal pad.
A package of integrated circuit device, the package comprising:
- a first conductive pad;
- a dielectric layer encircling the first conductive pad, wherein the dielectric layer further comprises a plurality of portions penetrating through the first conductive pad, and wherein the plurality of portions are separated from each other by the first conductive pad;
- an Under-Bump Metallurgy (UBM) comprising:
- a first via portion extending into the dielectric layer to contact the first conductive pad;
- and
- a pad portion higher than the dielectric layer, wherein the pad portion overlaps the plurality of portions of the dielectric layer, and wherein the first conductive pad laterally extends beyond edges of the pad portion of the UBM;
- a solder region over and contacting the UBM;
- and
- an integrated passive device, wherein the solder region bonds the UBM to the integrated passive device.
A package of integrated circuit device, the package comprising:
- a two-terminal passive device die comprising:
- a first terminal;
- and
- a second terminal, wherein the first terminal and the second terminal are adjacent to opposite edges of the two-terminal passive device die;
- a conductive feature comprising:
- a pad portion underlying, and electrically coupling to, the first terminal;
- and
- a plurality of via portions underlying the pad portion, wherein the plurality of via portions form a continuous region with the pad portion;
- a dielectric layer underlying and contacting the pad portion, wherein the plurality of via portions extend into the dielectric layer;
- and
- a first metal pad in the dielectric layer, wherein the first metal pad is in contact with the plurality of via portions.
Dependencies are inferred from the claim text.