Integrated system of an electronic module and conductive fabric and method of making the same
AssigneeFlextronics AP, LLC
InventorsWeifeng LIU, Anwar MOHAMMED, Murad KURWA
Life of this patent
Estimating the term…
Abstract
An electronic module assembly and method of assembling an electronic module to a conductive fabric are provided. An electronic module assembly comprises a non-conductive fabric and a conductive fabric covering at least part of a first side of the non-conductive fabric. An electronics module is disposed on the conductive fabric, and a portion of the electronics module includes a wall defining a through hole. A fastener passing through the through hole and passing through the conductive fabric is configured to electronically couple the electronics module to the conductive fabric.
Claims14
A method of making an electronics assembly comprising an electronics module and a conductive fabric, comprising:
- forming a substrate including a conductive fabric covering part of a first side of a non-conductive fabric;
- disposing an electronics module comprising a top surface, a bottom surface, and walls defining one or more through holes on the substrate with the one or more through holes aligned with a portion of the conductive fabric;
- inserting a fastener to pass through each of the one or more through holes and through at least the conductive fabric;
- and
- clamping the electronics module to the substrate to form an electrical connection using the fastener.
Dependencies are inferred from the claim text.