Semiconductor devices and methods for enhancing signal integrity of an interface provided by a semiconductor device
AssigneeMediatek Inc.
InventorsDuen-Yi HO, Hung-Chuan CHEN, Shang-Pin CHEN
Life of this patent
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Abstract
A semiconductor device includes a substrate, a die and multiple conductive traces. The die is mounted on the substrate. The conductive traces are routed on the substrate and connected to the die. The conductive traces at least include a plurality of first conductive traces and a plurality of second conductive traces. The second conductive traces are coupled to a predetermined voltage for providing a shielding pattern. The first conductive traces and the second conductive traces are disposed on the substrate in a substantially interlaced pattern.
Claims21
A semiconductor device, comprising:
- a substrate;
- a die, mounted on the substrate;
- and
- a plurality of conductive traces, routed on the substrate and connected to the die,
- wherein the conductive traces at least comprise a plurality of first conductive traces and a plurality of second conductive traces, the second conductive traces are coupled to a predetermined voltage for providing a shielding pattern, and
- wherein the first conductive traces and the second conductive traces are disposed on the substrate in a substantially interlaced pattern.
A method for enhancing signal integrity of an interface provided by a semiconductor device, wherein the semiconductor device is capable of controlling access operations of accessing to at least two types of external device via the interface, and the method comprises:
- providing a die on a substrate of the semiconductor device, wherein the die is capable of operating in at least a first mode and a second mode according to the type of the external device;
- providing a plurality of first conductive traces and a plurality of second conductive traces to be coupled to the die, wherein the second conductive traces are coupled to a predetermined voltage for providing a shielding pattern;
- interlacing arrangements of the first conductive traces and the second conductive traces, wherein the first conductive traces and the second conductive traces are interlaced with each other;
- and
- coupling the first conductive traces and the second conductive traces to corresponding pads of the die.
A semiconductor device, comprising:
- a substrate;
- a die, mounted on the substrate;
- and
- a plurality of conductive traces, routed on the substrate and connected to the die, wherein the conductive traces are configured to provide an interface for interfacing with an external device and the die is capable of operating in at least a first mode and a second mode according to a type of the external device coupled thereto, and wherein the conductive traces at least comprise a plurality of first conductive traces, and
- wherein when the die is configured to operate in the first mode, the first conductive traces are configured to perform bidirectional signal transmission, and when the die is configured to operate in the second mode, the first conductive traces are configured to perform unidirectional signal transmission.
Dependencies are inferred from the claim text.