Optical module
AssigneeFujitsu Component Limited
InventorsShinichiro Akieda, Osamu Daikuhara, Hongfei Zhang
Life of this patent
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Abstract
An optical module includes a housing having an upper cover and a lower cover; a substrate having a circuit device mounted on its first surface; a heat dissipation member configured to be in contact with the circuit device mounted on the substrate; and at least one inner case having stiffness, wherein the upper cover is disposed facing the first surface of the substrate, and the lower cover is disposed facing a second surface of the substrate, and the inner case is disposed so as to press the substrate from the second surface of the substrate toward the upper cover.
Claims5
An optical module comprising:
- a housing having an upper cover and a lower cover;
- a substrate having a circuit device mounted on its first surface;
- a heat dissipation member configured to be in contact with the circuit device mounted on the substrate;
- and
- at least one inner case having stiffness,
- wherein the upper cover is disposed facing the first surface of the substrate, and the lower cover is disposed facing a second surface of the substrate, and
- the inner case is disposed so as to press the substrate from the second surface of the substrate toward the upper cover.
Dependencies are inferred from the claim text.