Band stop filter structures and methods of forming and operating same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorMing Hsien TSAI
Life of this patent
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Abstract
A filter structure including a ground plane wherein the ground plane is in a first metal layer of an integrated circuit (IC) package. The filter structure further includes a plate in a second metal layer of the IC package. The filter structure further includes a dielectric layer between the ground plane and the plate, wherein the ground plane, the dielectric layer, and the plate are thereby configured as a capacitive device. The filter structure further includes an inductive device in a third metal layer of the IC package, wherein the inductive device is electrically connected to the plate.
Claims20
A filter structure comprising:
- a ground plane in a first metal layer of an integrated circuit (IC) package;
- a plate in a second metal layer of the IC package;
- a dielectric layer between the ground plane and the plate, the ground plane, the dielectric layer, and the plate thereby being configured as a capacitive device;
- and
- an inductive device in a third metal layer of the IC package,
- wherein the inductive device is electrically connected to the plate.
A method of forming a filter structure, the method comprising:
- forming a ground plane in a first post-passivation interconnect (PPI) layer of an integrated circuit (IC) package;
- forming a plate in a second PPI layer of the IC package;
- depositing a dielectric layer between the ground plane and the plate;
- forming an inductive device in a third PPI interconnect layer of the IC package;
- and
- constructing an electrical connection between the plate and the inductive device,
- wherein the forming the ground plane, the forming the plate, and the depositing the dielectric layer are part of constructing a capacitive device.
A method of filtering a signal, the method comprising:
- receiving an input signal at a first terminal of a filter structure in an integrated circuit (IC) package;
- reducing a high frequency component of the input signal using the filter structure to generate an output signal;
- and
- providing the output signal at a second terminal of the filter structure,
- wherein the filter structure comprises:
- an inductive device in a first metal layer of the IC package;
- and
- a capacitive device electrically connected to the inductive device, the capacitive device comprising a first plate in a second metal layer of the IC package and a second plate in a third metal layer of the IC package.
Dependencies are inferred from the claim text.