Circuit having snubber circuit in power supply device

A circuit in a power supply device, comprising:

• a snubber circuit, comprising:
• a transistor structure, comprising:
• a chip package, comprising a transistor die and a molding compound encapsulating the transistor die;
• a first pin;
• and
• a second pin, wherein the transistor structure electrically connects three different bonding pads of the transistor die to only two pins of the transistor structure by electrically connecting the three different bonding pads to the first pin and the second pin each having a part embedded in the molding compound and another part outside the molding compound;
• the three different bonding pads of the transistor die comprises a first bonding pad, a second bonding pad and a third bonding pad;
• the part of the first pin embedded in the molding compound is simultaneously and directly connected to the first bonding pad and the second bonding pad of the transistor die within the molding compound;
• and the part of the second pin embedded in the molding compound is electrically connected to the third bonding pad of the transistor die different from each of the first bonding pad and the second bonding pad;
• and
• a first capacitor, wherein the another part of the first pin or the another part of the second pin of the transistor structure outside the molding compound is electrically connected to a first terminal of the first capacitor;
• and
• an active component, connected to the snubber circuit, capable of switching at a high frequency;
• wherein when the active component switches at the high frequency, the snubber circuit absorbs spikes or noise generated by the active component to the first capacitor, and then pushes energy of the absorbed spikes or the absorbed noise from the first capacitor back to the active component to perform an energy recycling operation.