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US 2019/0097387 A1Published application
Optical package structure, optical module, and method for manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsYu-Hsuan TSAI, Lu-Ming LAI, Ying-Chung CHEN, Shih-Chieh TANG
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Abstract
An optical package structure includes a substrate having a first surface, an interposer bonded to the first surface through a bonding layer, the interposer having a first area from a top view perspective, and an optical device on the interposer, having a second area from the top view perspective, the first area being greater than the second area. A method for manufacturing the optical package structure is also provided.
Claims20
An optical package structure, comprising:
- a substrate having a first surface;
- an interposer bonded to the first surface through a bonding layer, the interposer having a first area from a top view perspective;
- an optical device on the interposer, the optical device having a second area from the top view perspective,
- wherein the first area is greater than the second area.
1 more element
An optical module, comprising:
- a ceramic substrate;
- a silicon interposer on the ceramic substrate;
- a bonding layer between the ceramic substrate and the silicon interposer;
- and
- an optical device disposed on and electrically connected to the silicon interposer,
- wherein the bonding layer comprises a first thickness at one end of the interposer and a second thickness at an opposite end of the interposer, the first thickness being different from the second thickness.
3 more elements
A method for manufacturing an optical package structure, comprising:
- providing an interposer, the interposer having a bond pad on a front surface;
- placing an optical device on the front surface of the interposer, the optical device having a bonding surface with eutectic alloys;
- illuminating, by a light source, the eutectic alloys to bond the optical device to the interposer;
- and
- joining the interposer and a substrate through a bonding layer.
2 more elements
Dependencies are inferred from the claim text.