Ni-Plated Copper Or Copper Alloy Material, Connector Terminal, Connector And Electronic Component Using The Same
AssigneeJX Nippon Mining & Metals Corporation
InventorSatoru Endo
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Abstract
The present invention provides a Ni-plated copper or copper alloy material having both excellent hardness and excellent bendability. In the Ni-plated copper or copper alloy material having, an area ratio of a crystal having <001> plane orientation in a crystal plane parallel to a surface of a Ni plating, measured by an electron backscatter diffraction, is 15 to 35%.
Claims12
A Ni-plated copper or copper alloy material, wherein an area ratio of a crystal having <001> plane orientation in a crystal plane parallel to a surface of a Ni plating, measured by an electron backscatter diffraction, is 15 to 35%.
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Dependencies are inferred from the claim text.