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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsMin-Chien Hsiao, Chen-Hua Yu, Chung-Shi Liu, Chao-Wen Shih, Shou-Zen Chang
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In accordance with some embodiments, a package structure includes an RFIC chip. an insulating encapsulation, a redistribution circuit structure, an antenna and a microwave director. The insulating encapsulation encapsulates the RFIC chip. The redistribution circuit structure is disposed on the insulating encapsulation and electrically connected to the RFIC chip. The antenna is disposed on the insulating encapsulation and electrically connected to the RFIC chip through the redistribution circuit structure. The antenna is located between the microwave director and the RFIC chip. The microwave director has a microwave directivity enhancement surface located at a propagating path of a microwave received or generated by the antenna.
A package structure, comprising:
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An electronic device, comprising:
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A package structure, comprising:
Dependencies are inferred from the claim text.