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US 2019/0097183 A1Published application
Thin film solid-state microbattery packaging
AssigneeInternational Business Machines Corporation
InventorsQianwen Chen, Bing Dang, John Knickerbocker, Bo Wen
Life of this patent
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Abstract
Systems and/or techniques associated with a solid-state microbattery packaging system are provided. In one example, a device comprises a substrate layer and a tape substrate layer. The substrate layer is associated with a set of solid-state microbattery components. The tape substrate comprises a releasable adhesive material and a polymer sealing material. A conductive surface associated with the set of solid-state microbattery components is disposed on the releasable adhesive material of the tape substrate layer.
Claims9
A method, comprising:
- attaching a set of solid-state microbattery components to a surface of a substrate layer that comprises a glass material;
- disposing a conductive surface associated with the set of solid-state microbattery components onto a tape substrate layer that comprises a releasable adhesive material;
- and
- separating the set of solid-state microbattery components via a laser release process that ablates and de-bonds an interface between the set of solid-state microbattery components and the tape substrate layer.
1 more element
Dependencies are inferred from the claim text.