Thin film solid-state microbattery packaging
AssigneeInternational Business Machines Corporation
InventorsQianwen Chen, Bing Dang, John Knickerbocker, Bo Wen
Life of this patent
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Abstract
Systems and/or techniques associated with a solid-state microbattery packaging system are provided. In one example, a device comprises a substrate layer and a tape substrate layer. The substrate layer is associated with a set of solid-state microbattery components. The tape substrate comprises a releasable adhesive material and a polymer sealing material. A conductive surface associated with the set of solid-state microbattery components is disposed on the releasable adhesive material of the tape substrate layer.
Claims12
A device, comprising:
- a substrate layer associated with a set of solid-state microbattery components;
- and
- a tape substrate layer that comprises a releasable adhesive material and a polymer sealing material, wherein a conductive surface associated with the set of solid-state microbattery components is disposed on the releasable adhesive material of the tape substrate layer.
9-17. (canceled)
A packaged microbattery device, comprising:
- a substrate layer that comprises an insulator material, wherein a microbattery component is formed on a surface of the substrate layer;
- an adhesive layer that comprises a releasable adhesive material;
- an insulator cap layer this is aligned and bonded onto the microbattery using the adhesive layer;
- and
- a hermetic coating layer that couples the microbattery to the substrate layer.
Dependencies are inferred from the claim text.