OLED Packaging Structure and Manufacturing Method Thereof

An organic light-emitting diode (OLED) packaging structure, comprising:

• a substrate;
• an OLED, disposed on the substrate and including an active display region and a non-active display region on a periphery of the active display region;
• a packaging peripheral region, disposed on the substrate and configured to package a portion except the OLED;
• a packaging region, disposed on the OLED and configured to package the active display region of the OLED;
• and
• a packaging transition region, disposed between the packaging peripheral region and the packaging region and configured to package the non-active display region of the OLED,
• wherein each of the packaging peripheral region, the packaging region and the packaging transition region includes an packaging layer, and a thickness of the packaging layer of the packaging transition region is greater than the thickness of the packaging layer of the packaging peripheral region.