Organic light-emitting diode display device and method of fabricating the same
AssigneeLG Display Co., Ltd.
InventorsJongHyeok IM, SeJune KIM, JoonSuk LEE, SoJung LEE, JaeSung LEE
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Abstract
An organic light-emitting diode (OLED) display device and a method of fabricating the same can reduce resistance of a cathode by forming an auxiliary electrode. Also, such OLED display device and method can prevent damage on a pad electrode due to an etchant during patterning of an anode by applying a protective structure to the pad electrode of a pad area and by including the pad electrode exposed from a plurality of pad electrode layers.
Claims14
1-20. (canceled)
An organic light-emitting diode (OLED) display device, comprising:
- a substrate including a display area and a pad area;
- a gate line and a data line in the display area;
- a pad line and a pad electrode in the pad area;
- a patterned anode in the display area;
- and
- an encapsulation layer on the substrate for covering the display area,
- wherein the pad area is exposed without being covered by the encapsulation layer to couple a flexible printed circuit board,
- wherein the pad electrode is a three-layered structure,
- wherein an uppermost layer and a lowermost layer of the three-layered structure are of the same material,
- wherein an intermediate layer of the three-layered structure is comprised of a low resistive material compared with materials of the uppermost and lowermost layers,
- wherein the uppermost layer is in contact with both sides of the lowermost layer to seal the intermediate layer, and
- wherein the pad line is comprised of a conductive material to transfer a scan signal and a data signal to the gate line and the data line, respectively, and is disposed below the lowermost layer and contacted with the lowermost layer.
A method of fabricating an organic light-emitting diode (OLED) display device, the method comprising:
- forming a thin film transistor on a display area of a substrate;
- forming a pad electrode having a three-layered structure on a pad area of the substrate;
- forming an open hole exposing a portion of an uppermost layer of the pad electrode by selectively etching a passivation layer on the pad area;
- and
- patterning an anode on the passivation layer over the thin film transistor by etching,
- wherein the uppermost layer exposed via the open hole is not etched during the patterning of the anode.
Dependencies are inferred from the claim text.