Light emitting device and leadframe thereof

A LED leadframe configured for securing a LED chip, wherein the LED leadframe comprises:

• a metallic base, comprising a die bonding region and a peripheral region surrounding the die bonding region;
• wherein the die bonding region is configured for securing the LED chip thereon, the die bonding region comprises a chip-mounted section and a chip-blank section;
• an insulating layer, disposed on the metallic base and located in the peripheral region to define the die bonding region;
• wherein the metallic base further comprises a second groove defined corresponding to the chip-blank section, the second groove is filled with a filler, and a specific heat capacity of the filler is smaller than a specific heat capacity of the metallic base.

A light emitting device comprising:

• LED chips, a package glue and a LED leadframe;
• wherein the LED leadframe comprises:
• a metallic base, comprising a die bonding region and a peripheral region surrounding the die bonding region;
• wherein the die bonding region comprises chip-mounted sections and a chip-blank section;
• an insulating layer, disposed on the metallic base and located in the peripheral region to define the die bonding region;
• wherein the metallic base further comprises first grooves defined corresponding to the chip-mounted sections, the first grooves are filled with a thermally conductive filler, and a thermal conductivity of the thermally conductive filler is larger than a thermal conductivity of the metallic base;
• wherein the LED chips are mounted on the chip-mounted sections of the die bonding region, and the package glue is filled in the die bonding region and covers the LED chips.

A light emitting device comprising:

• LED chips, a package glue and a LED leadframe;
• wherein the LED leadframe comprises:
• a metallic base, comprising a die bonding region and a peripheral region surrounding the die bonding region, the die bonding region comprising chip-mounted sections and a chip-blank section;
• an insulating layer, disposed on the metallic base and located in the peripheral region to define the die bonding region;
• wherein the metallic base further comprises at least one second groove defined corresponding to the chip-blank section, the at least one second groove is filled with a filler, and a specific heat capacity of the filler is smaller than a specific heat capacity of the metallic base;
• wherein the LED chips are mounted on the chip-mounted sections of the die bonding region, and the package glue is filled in the die bonding region and covers the LED chips.