Connection Carrier, Optoelectronic Component and Method for Producing a Connection Carrier or an Optoelectronic Component
OwnerEckhard Ditzel, Tihomir Klajic +2inventors
InventorsEckhard Ditzel, Tihomir Klajic, Reiner Windisch, Andreas Biebersdorf
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Abstract
A connection carrier, an optoelectronic component and a method for producing a connection carrier or an optoelectronic component are disclosed. In an embodiment a connection carrier includes a substrate, an electrically insulating connecting element, an electrically conductive contact element and an insulation element.
Claims16
1-14. (canceled)
A connection carrier comprising:
- a substrate comprising:
- a substrate top surface;
- a substrate bottom surface opposite the substrate top surface;
- and
- a substrate side surface,
- an electrically insulating connecting element;
- an electrically conductive contact element;
- and
- an insulation element,
- wherein the connecting element is arranged on the substrate top surface,
- wherein the contact element is arranged on the connecting element opposite the substrate,
- wherein the insulation element is arranged on the contact element opposite the connecting element,
- wherein the substrate side surface connects the substrate top surface and the substrate bottom surface,
- wherein the insulation element covers the contact element on a contact element cover surface facing away from the connecting element and on a contact element side surface facing the substrate side surface,
- wherein the substrate top surface is freely accessible in a central region,
- wherein the central region is surrounded laterally by the insulation element, and
- wherein the insulation element covers the connecting element on the connecting element side surface facing the substrate side surface.
A method for producing a connection carrier, wherein the connection carrier comprises a substrate having a substrate top surface, a substrate bottom surface opposite the substrate top surface and a substrate side surface, an electrically insulating connecting element, an electrically conductive contact element, and an insulation element, the method comprising:
- providing an assembly comprising a plurality of the substrates attached to each other;
- producing mounting and separating openings in the substrates by punching;
- and
- separating the assembly along the separating openings.
Dependencies are inferred from the claim text.