Light emitting diode element apparatus and manufacturing method thereof

A manufacturing method of the light emitting diode element apparatus, comprising:

• providing an encapsulating structure array, the encapsulating structure array having a plurality of encapsulating structures, each encapsulating structure having a support base, at least one reflective wall, and two encapsulating electrodes;
• arranging multiple flip chips respectively in the support base, the flip chip having a light emitting diode element and two chip electrodes, the two chip electrodes being set below the light emitting diode element, the upper side of the light emitting diode element emitting light when the sidewall being electrically conducting;
• connecting the two encapsulating electrodes with the two chip electrodes through solder respectively and electrically, at least one reflective wall directed toward the side wall of the light emitting diode element to direct light emitted from the side wall of the light emitting diode element to a predetermined direction;
• and
• removing the multiple encapsulating structures from the encapsulating structure array.