Unit substrate for optical device and optical device package having same
AssigneePoint Engineering Co., Ltd.
InventorsBum Mo AHN, Seung Ho PARK, Moon Hyun KIM
Life of this patent
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Abstract
Disclosed is a unit substrate for an optical device, the unit substrate including: an optical device-mounting region provided on an upper surface of the unit substrate; and first and second metal substrates bonded to each other with a vertical insulating layer interposed therebetween. A lower surface of the unit substrate is electrically connected to the mounting region, and side and upper surfaces of the unit substrate are electrically isolated from the mounting region such that an optical device is capable of operating in an environment with low electrical resistance.
Claims9
A unit substrate for an optical device, the unit substrate comprising:
- an optical device-mounting region provided on an upper surface of the unit substrate;
- and
- first and second metal substrates bonded to each other with a vertical insulating layer interposed therebetween,
- wherein a lower surface of the unit substrate is electrically connected to the mounting region, and
- side and upper surfaces of the unit substrate are electrically isolated from the mounting region.
An optical device package comprising:
- an optical device mounted in a cavity;
- first and second metal substrates bonded to each other with a vertical insulating layer interposed therebetween;
- and
- a light transmitting member provided on the cavity,
- wherein a lower surface of the optical device package is electrically connected to the optical device, and
- side and upper surfaces of the optical device package are electrically isolated from the optical device.
Dependencies are inferred from the claim text.