Integrated circuit devices
AssigneeSamsung Electronics Co., Ltd.
InventorsJun-hyeok AHN, Eun-jung Kim, Hui-jung Kim, Ki-seok Lee, Bong-soo Kim, Myeong-dong Lee, Sung-hee Han, Yoo-sang Hwang
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AssigneeSamsung Electronics Co., Ltd.
InventorsJun-hyeok AHN, Eun-jung Kim, Hui-jung Kim, Ki-seok Lee, Bong-soo Kim, Myeong-dong Lee, Sung-hee Han, Yoo-sang Hwang
Estimating the term…
An integrated circuit device may include a pair of line structures. Each line structure may include a pair of conductive lines extending over a substrate in a first horizontal direction and a pair of insulating capping patterns respectively covering the pair of conductive lines. The integrated circuit device may include a conductive plug between the pair of line structures and a metal silicide film contacting a top surface of the conductive plug between the pair of insulating capping patterns. The conductive plug may have a first width between the pair of conductive lines and a second width between the pair of insulating capping patterns, in a second horizontal direction perpendicular to the first horizontal direction, where the second width is greater than the first width.
An integrated circuit device, comprising:
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An integrated circuit device comprising:
Dependencies are inferred from the claim text.