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US 2019/0096940 A1Published application
Solid-state imaging device, manufacturing method thereof, and camera with alternatively arranged pixel combinations
AssigneeSony Semiconductor Solutions Corporation
InventorsHiroaki Ishiwata, Sanghoon Ha
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Abstract
A solid-state imaging device includes a semiconductor substrate; and a pixel unit having a plurality of pixels on the semiconductor substrate, wherein the pixel unit includes first pixel groups having two or more pixels and second pixel groups being different from the first pixel groups, wherein a portion of the pixels in the first pixel groups and a portion of the pixels in the second pixel groups share a floating diffusion element.
Claims21
1-9. (canceled)
An imaging device, comprising:
- a pixel array including a plurality of sub-arrays, respective ones of the plurality of sub-arrays including four pixels arranged in a 2×2 matrix, respective ones of the pixels including a photodiode and a transfer transistor;
- and
- a plurality of on-chip lenses, wherein
- each pixel of a first sub-array of the plurality of sub-arrays and a second sub-array of the plurality of sub-arrays includes a green-light-transmitting filter,
- each pixel of a third sub-array of the plurality of sub-arrays includes a blue-light-transmitting filter,
- each pixel of a fourth sub-array of the plurality of sub-arrays includes a red-light-transmitting filter,
- the first sub-array is disposed diagonally to the second sub-array,
- the third sub-array is disposed diagonally to the fourth sub-array, and
- each of the plurality of on-chip lenses is disposed corresponding to the respective ones of pixels in each of the first, second, third, and fourth sub-arrays.
6 more elements
A camera apparatus, comprising:
- an optical system;
- an imaging device, comprising:
- a pixel array including a plurality of sub-arrays, respective ones of the plurality of sub-arrays including four pixels arranged in a 2×2 matrix, respective ones of the pixels including a photodiode and a transfer transistor;
- and
- a plurality of on-chip lenses, wherein
- each pixel of a first sub-array of the plurality of sub-arrays and a second sub-array of the plurality of sub-arrays includes a green-light-transmitting filter,
- each pixel of a third sub-array of the plurality of sub-arrays includes a blue-light-transmitting filter,
- each pixel of a fourth sub-array of the plurality of sub-arrays includes a red-light-transmitting filter,
- the first sub-array is disposed diagonally to the second sub-array,
- the third sub-array is disposed diagonally to the fourth sub-array, and
- each of the plurality of on-chip lenses is disposed corresponding to the respective ones of pixels in each of the first, second, third, and fourth sub-arrays;
- and
- a signal processing circuitry.
10 more elements
Dependencies are inferred from the claim text.