Semiconductor device and method for fabricating the same
AssigneeSamsung Electronics Co., Ltd.
InventorsMYEONG-DONG LEE, JUN-WON LEE, KI SEOK LEE, BONG-SOO KIM, SEOK HAN PARK, SUNG HEE HAN, YOO SANG HWANG
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AssigneeSamsung Electronics Co., Ltd.
InventorsMYEONG-DONG LEE, JUN-WON LEE, KI SEOK LEE, BONG-SOO KIM, SEOK HAN PARK, SUNG HEE HAN, YOO SANG HWANG
Estimating the term…
A semiconductor device includes a substrate having a trench, a bit line in the trench, a first spacer extending along the trench and at least a portion of a side surface of the bit line and in contact with the bit line, and a second spacer disposed within the trench on the first spacer. The bit line is narrower than the trench, and the first spacer includes silicon oxide. A method of forming a semiconductor device includes forming a trench in a substrate, forming a bit line within the first trench of width less than that of the first trench, and forming a first spacer that lines a portion of the trench and includes silicon oxide in contact with at least a portion of a side surface of the bit line, and forming a second spacer over the first spacer in the trench.
A semiconductor device comprising:
A semiconductor device comprising:
A semiconductor device comprising:
Dependencies are inferred from the claim text.