Semiconductor packages and methods of manufacturing the same
AssigneeSamsung Electronics Co., Ltd.
InventorsYoung Lyong KIM, Jin-woo PARK, CHOONGBIN YIM, Younji MIN
Life of this patent
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Abstract
Provided are a semiconductor package and a method of manufacturing the same. The semiconductor package comprises a substrate, a semiconductor chip on the substrate, an interconnect substrate spaced apart from the semiconductor chip on the substrate and including a conductive member therein, a solder ball on the interconnect substrate and electrically connected to the conductive member, a polymer layer on the interconnect substrate and the semiconductor chip and including an opening through which the solder ball is exposed, and polymer particles in the solder ball and including the same material as the polymer layer.
Claims20
-20. (canceled)
A semiconductor package, comprising:
- a redistribution substrate;
- a semiconductor chip on the redistribution substrate;
- a conductive member spaced apart from the semiconductor chip on the redistribution substrate;
- a solder ball on the conductive member and electrically connected to the conductive member;
- and
- a polymer layer between the semiconductor chip and the conductive member on the redistribution substrate, the polymer layer having an opening through which the solder ball is exposed,
- wherein a bottom surface of the solder ball is disposed at a higher level than a bottom surface of the semiconductor chip.
A semiconductor package, comprising:
- a substrate;
- a semiconductor chip on a center region of the substrate;
- a conductive member on an edge region of the substrate;
- a solder ball on the conductive member and electrically connected to the conductive member;
- a polymer layer between the semiconductor chip and the conductive member on the substrate, the polymer layer having an opening through which the solder ball is exposed;
- and
- polymer particles in the solder ball and including the same material as the polymer layer.
Dependencies are inferred from the claim text.