Semiconductor package, method for forming semiconductor package, and method for forming semiconductor assembly

A method for forming a semiconductor package, comprising:

• providing a first package component comprising a first side and a second side opposite to the first side, wherein the first package component comprises a plurality of recessed corners on the first side and a plurality of first stress buffer structures disposed at the recessed corners;
• bonding the first package component to a second package component with the first side facing the second package component;
• and
• forming an underfill material between the first package component and the second package component, wherein at least a portion of the first stress buffer structures is in contact with and embedded in the underfill material.

A method for forming a semiconductor assembly, comprising;

• receiving a semiconductor wafer comprising a plurality of chip regions and scribe line regions spacing apart individual chip regions;
• forming a plurality of grooves in the scribe line regions, wherein the grooves are intersected to form a plurality of intersection regions;
• disposing a plurality of first stress buffer structures at the intersection regions, wherein a diameter of one of the first stress buffer structures is greater than a width of the grooves;
• and
• cutting through one of the first stress buffer structures by cutting along the grooves.