Semiconductor component, package structure and manufacturing method thereof

A method for manufacturing a package structure, comprising:

• providing a semiconductor substrate;
• forming a first bonding layer on the semiconductor substrate;
• disposing at least one semiconductor device on the semiconductor substrate;
• fusion bonding the at least one semiconductor device to the semiconductor substrate through a portion of the first bonding layer;
• forming an insulating encapsulation to at least wrap a sidewall of the at least one semiconductor device;
• performing a first planarizing step to planarize the insulating encapsulation;
• forming a redistribution circuit structure on the at least one semiconductor device and on the insulating encapsulation;
• and
• disposing conductive elements on the redistribution circuit structure.

A method for manufacturing a semiconductor component, comprising:

• providing a first semiconductor carrier;
• forming a bonding layer on the first semiconductor carrier;
• disposing a second semiconductor carrier on the first semiconductor carrier;
• fusion bonding the second semiconductor carrier to the first semiconductor carrier through the bonding layer, the second semiconductor carrier being bonded on a surface of the bonding layer, and an entire continuous surface of the second semiconductor carrier being in physical contact with the surface of the bonding layer;
• performing a first planarizing step on the first semiconductor carrier;
• performing a second planarizing step on the second semiconductor carrier;
• and
• performing a dicing process.

A method for manufacturing a package structure, comprising:

• providing a semiconductor substrate;
• forming a first bonding layer on the semiconductor substrate;
• disposing a semiconductor device on the semiconductor substrate;
• fusion bonding the semiconductor device to the semiconductor substrate through the first bonding layer;
• encapsulating the semiconductor device by an insulating encapsulation;
• and
• forming a redistribution circuit structure on the semiconductor device and on the insulating encapsulation.