Display with embedded pixel driver chips
AssigneeApple Inc.
InventorsEdzer Huitema, Vaibhav Patel, Tore Nauta, Xia Li, Hsin-Hua Hu
Life of this patent
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Abstract
Embodiments describe a display integration scheme in which an array of pixel driver chips embedded front side up in an insulator layer. A front side redistribution layer (RDL) spans across and is in electrical connection with the front sides of the array of pixel driver chips, and an array of light emitting diodes (LEDs) is bonded to the front side RDL. The pixel driver chips may be located directly beneath the display area of the display panel.
Claims20
A method of fabricating a micro chip comprising:
- forming metal contact layer over a plurality of exposed contact vias on a device substrate;
- forming trenches through a build-up structure and into a device layer of the device substrate, wherein the metal contact layer is a continuous layer on and in electrical contact with all of the plurality of contact vias;
- bonding the build-up structure side of the device substrate to a carrier substrate;
- removing a bulk substrate from the device substrate to expose a back side of the device substrate;
- forming a back side patterned sacrificial layer on the device layer;
- forming a stabilization structure on the back side of the device substrate;
- removing the carrier substrate;
- and
- removing the back side patterned sacrificial layer, wherein the metal contact layer remains a continuous layer on and in electrical contact with all of the plurality of contact vias.
A method of forming a display panel comprising:
- mounting a plurality of pixel driver chips face-up on a display substrate, wherein each pixel driver chip includes a plurality of contact vias and a continuous top metal contact layer on and in electrical contact with all of the plurality of contact vias;
- patterning the metal contact layers of the plurality of pixel driver chips to form a pattern of contact pads on each pixel driver chip;
- forming a redistribution layer (RDL) on the plurality of pixel driver chips;
- and
- integrating an array of light emitting elements over the RDL.
A display panel comprising:
- an array of pixel driver chips embedded in an insulator layer, each pixel driver chip comprising a plurality of contact vias coupled to a plurality of contact pads, such that an array of chip contact vias and an array of chip contact pads is distributed across the display panel;
- an array of light emitting elements coupled to the array of pixel driver chips;
- wherein placement distribution of the array of pixel driver chips across the display panel is characterized by a standard deviation that is larger than a standard deviation for position distribution of the array of contact pads across the display panel.
A packaging method comprising:
- mounting a plurality of chips face-up on a substrate, wherein each chip includes a plurality of contact vias and a continuous top metal contact layer on and in electrical contact with all of the plurality of contact vias;
- patterning the metal contact layers of the plurality of chips to form a pattern of contact pads on each chip;
- and
- forming a redistribution layer (RDL) on the plurality of chips.
Dependencies are inferred from the claim text.