Surface mount device/integrated passive device on package or device structure and methods of forming

A package structure comprising:

• a die;
• an encapsulant at least laterally encapsulating the die;
• a redistribution structure on the encapsulant, the redistribution structure comprising a dielectric layer on a metallization layer;
• a first under-terminal structure on the redistribution structure, the first under-terminal structure comprising a first extending portion extending through the dielectric layer to a first pattern of the metallization layer and comprising a second extending portion extending through the dielectric layer to a second pattern of the metallization layer, the first under-terminal structure further comprising a first upper portion disposed on the dielectric layer and connecting the first extending portion and the second extending portion;
• a dummy pattern in the metallization layer and under the first upper portion of the first under-terminal structure, wherein the dummy pattern comprises an electrically conductive material and is electrically isolated, wherein the first under-terminal structure extends laterally beyond lateral extents of the dummy pattern;
• and
• an electrical device having a first terminal attached to the first under-terminal structure.

A method comprising:

• surrounding an integrated circuit die with an encapsulant;
• forming a redistribution structure on the encapsulant, the redistribution structure comprising a topmost dielectric layer on a topmost metallization layer, wherein the topmost metallization layer has a first metallization pattern and a second metallization pattern physically separated from the first metallization pattern;
• forming a first under-terminal metallization on the redistribution structure, the first under-terminal metallization comprising a first extending portion extending through the topmost dielectric layer to the first metallization pattern and comprising a second extending portion extending through the topmost dielectric layer to the second metallization pattern, wherein the first under-terminal metallization extends continuously along an upper surface of the topmost dielectric layer from the first extending portion to the second extending portion;
• and
• attaching a first terminal of an electrical device to the first under-terminal metallization, wherein the first terminal extends continuously from the first extending portion of the first under-terminal metallization to the second extending portion of the first under-terminal metallization.