Micro-LED Transfer Method, Manufacturing Method and Display Device
AssigneeGoertek Inc.
InventorQuanbo Zou
Life of this patent
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Abstract
A micro-LED transfer method, manufacturing method and display device are disclosed. The method comprises: coating conductive photoresist on a receiving substrate, wherein the conductive photoresist is positive-tone photoresist; bonding a carrier substrate with the receiving substrate via the conductive photoresist, wherein metal electrodes of micro-LEDs on the carrier substrate are aligned with electrodes on the receiving substrate and are bonded with the electrodes on the receiving substrate via the conductive photoresist, and the carrier substrate is a transparent substrate; selectively lifting-off micro-LEDs from the carrier substrate through laser lifting-off using a first laser; and separating the carrier substrate from the receiving substrate.
Claims10
A method for transferring micro-LEDs, comprising:
- coating conductive photoresist on a receiving substrate, wherein the conductive photoresist is positive-tone photoresist;
- bonding a carrier substrate with the receiving substrate via the conductive photoresist, wherein metal electrodes of micro-LEDs on the carrier substrate are aligned with electrodes on the receiving substrate and are bonded with the electrodes on the receiving substrate via the conductive photoresist, and the carrier substrate is a transparent substrate;
- selectively lifting-off micro-LEDs from the carrier substrate through laser lifting-off using a first laser;
- and
- separating the carrier substrate from the receiving substrate.
Dependencies are inferred from the claim text.