Packages Formed Using RDL-Last Process
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsMing-Fa Chen, Chen-Hua Yu
Life of this patent
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Abstract
A method includes bonding a first device die and a second device die to a substrate, and filling a gap between the first device die and the second device die with a gap-filling material. A top portion of the gap-filling material covers the first device die and the second device die. Vias are formed to penetrate through the top portion of the gap-filling material. The vias are electrically coupled to the first device die and the second device die. The method further includes forming redistribution lines over the gap-filling material using damascene processes, and forming electrical connectors over and electrically coupling to the redistribution lines.
Claims20
A device comprising:
- a blank substrate;
- a first device die and a second device die bonded to the blank substrate;
- a gap-filling material comprising:
- a first portion filling a gap between the first device die and the second device die;
- and
- a second portion covering the first device die and the second device die;
- vias penetrating through the second portion of the gap-filling material to electrically couple to the first device die and the second device die;
- a plurality of dielectric layers over the gap-filling material;
- and
- a plurality of redistribution lines in the plurality of dielectric layers, wherein the plurality of redistribution lines comprises dual damascene structures.
A device comprising:
- a heat spreader;
- a first oxide layer over the heat spreader;
- a first device die over and bonded to the heat spreader through the first oxide layer;
- a dielectric gap-filling material encircling the first device die;
- a plurality of low-k dielectric layers over the dielectric gap-filling material;
- a plurality of metal lines and vias in the plurality of low-k dielectric layers, wherein the plurality of metal lines and vias are electrically connected to the first device die;
- and
- a plurality of solder regions over and electrically coupling to the plurality of metal lines and vias.
A device comprising:
- a heat spreader;
- a first device die and a second device die over and attached to the heat spreader;
- a dielectric gap-filling material encapsulating the first device die and the second device die therein;
- vias penetrating through the dielectric gap-filling material to electrically couple to the first device die and the second device die;
- a plurality of redistribution lines over and electrically coupling to the vias, wherein the redistribution lines comprise dual damascene structures;
- and
- a plurality of electrical connectors electrically coupling to the plurality of redistribution lines.
Dependencies are inferred from the claim text.