Package structure and method of manufacturing the same

A package structure, comprising:

• a first die and a second die side by side;
• a first encapsulant, encapsulating sidewalls of the first die and sidewalls of the second die;
• a bridge, electrically connecting the first die and the second die;
• and
• an underfill layer between the bridge and the first die, between the bridge and the second die, and between the bridge and a portion of the first encapsulant,
• wherein at least a portion of the underfill layer is in contact with a portion of a top surface of the first die and a portion of a top surface of the second die.

A method of manufacturing a package structure, comprising:

• forming an encapsulant aside a first die and a second die, encapsulating sidewalls of the first die and sidewalls of the second die;
• forming a dielectric layer on the first die, the second die and the encapsulant;
• patterning the dielectric layer to form at least one first opening and a plurality of second openings, wherein the at least one first opening exposes a top surface of a first connector of the first die, and a top surface of a third connector of the second die, wherein the plurality of the second openings exposes a portion of a top surface of a second connector of the first die, and a portion of a top surface of a fourth connector of the second die;
• placing a bridge over and electrically connecting the first connector and the third connector through a plurality of conductive bumps;
• and
• forming an underfill layer, filling a space between the bridge and the first die, and between the bridge and the second die;
• wherein a width of the at least one first opening is larger than a width of the first connector, and larger than a width of the third connector.