Stacked package structure and manufacturing method thereof

A method for manufacturing a stacked package structure, comprising:

• forming a first package structure having a first surface and a second surface, comprising:
• forming a first release film on a first carrier substrate;
• forming a first redistribution layer on the first release film, wherein a bottom surface of the first redistribution layer serves as the first surface;
• attaching at least one first die on the first redistribution layer, wherein the first die has a first active region disposed on a side away from the first redistribution layer of the first die;
• forming a plurality of first bumps on the first die, wherein a part of the first bumps are electrically connected to the first active region;
• forming a plurality of first conductive features in the first die, wherein the first conductive features electrically connect the first redistribution layer to another part of the first bumps;
• and
• removing the first carrier substrate and the first release film.