Semiconductor device and method for manufacturing same

A method for manufacturing a semiconductor device, the method comprising:

• a first bonding process comprising bonding, at a first bonding point, a tip of a wire held by a capillary;
• a first lifting process comprising moving the capillary upward;
• a first reverse process comprising moving the capillary in a direction that includes a component in a first direction, the first direction being from a second bonding point toward the first bonding point;
• a second lifting process comprising moving the capillary upward;
• a second reverse process of moving the capillary in the first direction;
• a third lifting process comprising moving the capillary upward;
• a forward process comprising moving the capillary toward the second bonding point;
• and
• a second bonding process comprising bonding the wire at the second bonding point,
• wherein a movement distance of the capillary in the first reverse process is not less than a movement distance of the capillary in the second reverse process.

A semiconductor device comprising:

• a wire connected between a first bonding point and a second bonding point, the wire comprising:
• a first portion extending upward from the first bonding point,
• a second portion extending from an upper end of the first portion in a direction that includes a component in a direction from the first bonding point toward the second bonding point, and
• a third portion extending from the second portion toward the second bonding point,
• wherein two bend marks are formed in a side surface of the first portion of the wire on the second bonding point side, the two bend marks extending in a direction crossing an extension direction of the first portion.