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US 2019/0096845 A1Published application
Chip module and stacked structure
AssigneeUnimicron Technology Corp.
InventorsChin-Sheng WANG, Ra-Min TAIN
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Abstract
A chip module includes a body, a bump, and a first bonding layer. The bump is disposed on the body. The first bonding layer is disposed on the bump. The first bonding layers and the bump are made of the same conductive material and the first bonding layer is porous.
Claims18
A chip module, comprising:
- a body;
- a bump disposed on the body;
- and
- a first bonding layer disposed on the bump, wherein the first bonding layers and the bump are made of the same conductive material and the first bonding layer is porous.
1 more element
Dependencies are inferred from the claim text.