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US 2019/0096841 A1Published application
Package structure and method of manufacturing the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsMing-Kai Liu, Han-Ping Pu, Ting-Chu Ko, Yung-Ping Chiang, Chang-Wen Huang, Yu-Sheng Hsieh
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Abstract
Provided is a package structure includes a die having a first connector, a RDL structure disposed on the die, and a second connector. The RDL structure includes at least one elongated via located on and connected to the first connector. The second connector is disposed on and connected to the RDL structure.
Claims20
A package structure, comprising:
- a die having a first connector;
- a RDL structure disposed on the die, the RDL structure comprises at least one elongated via located on and connected to the first connector;
- and
- a second connector disposed on and connected to the RDL structure.
1 more element
A package structure, comprising:
- a die having a first connector;
- a RDL structure disposed over the die, wherein the RDL structure comprises a via on the first connector, wherein an area of a bottom surface of the via is larger than an area of a top surface of the via, and the bottom surface is in contact with and electrically connected to the first connector;
- and
- a second connector disposed on and connected to the RDL structure.
1 more element
A method of manufacturing a package structure, comprising:
- forming a RDL structure over a passivation and a first connector of a die, comprising:
- forming a patterned mask layer over the die;
- forming a conductive layer in an opening of the patterned mask layer;
- removing the patterned mask layer;
- performing a treatment process on the conductive layer to form a via, a top surface of the via being smaller than a bottom surface of the via;
- and
- forming a second connector over the RDL structure.
4 more elements
Dependencies are inferred from the claim text.