Integrated fan-out package and manufacturing method thereof

A manufacturing method of an integrated fan-out package, comprising:

• providing a carrier having an adhesive layer formed thereon;
• providing a first die and a second die on the adhesive layer, wherein a height of the first die is different from a height of the second die, the first die has first conductive posts and the second die has second conductive posts, the first conductive posts have substantially a same height, and the second conductive posts have substantially a same height;
• pressing the first die and the second die against the adhesive layer to make the active surfaces of the first die and the second die be in direct contact with the adhesive layer and the first and second conductive posts be submerged into the adhesive layer;
• curing the adhesive layer;
• forming an encapsulant to encapsulate the first die and the second die;
• removing the carrier from the adhesive layer;
• reducing heights of the first and second conductive posts and removing at least a portion of the adhesive layer such that the first and second conductive posts are laterally wrapped by the adhesive layer and are exposed from the adhesive layer, and top surfaces of the first conductive posts are levelled with top surfaces of the second conductive posts;
• and
• forming a redistribution structure over the adhesive layer and the first and second conductive posts such that the redistribution structure is electrically connected to the first and second conductive posts.

A manufacturing method of an integrated fan-out package, comprising:

• providing a first carrier having an adhesive layer formed thereon;
• pressing a first die and a second die against the adhesive layer, wherein the first die and the second die respectively has an active surface, a rear surface opposite to the active surface, and a plurality of conductive posts formed on the active surface, a height of the first die is different from a height of the second die, wherein the active surfaces of the first die and the second die are pressed to be in direct contact with the adhesive layer, and the plurality of conductive posts are submerged into the adhesive layer;
• forming an encapsulant to encapsulate the first die and the second die;
• attaching the rear surfaces of the first die and the second die to a second carrier;
• removing the first carrier and removing the adhesive layer from the first die, the second die, and the encaspulant;
• forming a base material layer over the encapsulant and the active surfaces of the first die and the second die to encapsulate the conductive posts;
• reducing heights of the base material layer and the plurality of conductive posts;
• forming a redistribution structure over the plurality of conductive posts such that the redistribution structure is electrically connected to the plurality of conductive posts;
• and
• removing the second carrier from the rear surfaces of the first die and the second die.

A manufacturing method of an integrated fan-out package, comprising:

• providing a carrier having an adhesive layer formed thereon;
• providing a first die and a second die on the adhesive layer, wherein a height of the first die is different from a height of the second die, the first die has first conductive posts and the second die has second conductive posts, the first conductive posts have substantially a same height, and the second conductive posts have substantially a same height;
• pressing the first die and the second die against the adhesive layer to make the active surfaces of the first die and the second die be in direct contact with the adhesive layer and the first and second conductive posts be submerged into the adhesive layer;
• forming an encapsulant to encapsulate the first die and the second die;
• removing the carrier from the adhesive layer;
• removing at least a portion of the adhesive layer;
• reducing heights of the first and second conductive posts such that top surfaces of the first conductive posts are levelled with top surfaces of the second conductive posts, wherein the first and second conductive posts are wrapped by a layer of a same material;
• and
• forming a redistribution structure over the first and second conductive posts such that the redistribution structure is electrically connected to the first and second conductive posts.