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US 2019/0096839 A1Published application
Substrate and Package Structure
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWei-Hung Lin, Hsiu-Jen Lin, Ming-Da Cheng, Yu-Min Liang, Chen-Shien Chen, Chung-Shi Liu
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Abstract
According to an exemplary embodiment, a substrate having a first area and a second area is provided. The substrate includes a plurality of pads. Each of the pads has a pad size. The pad size in the first area is larger than the pad size in the second area.
Claims20
A device comprising:
- a substrate comprising a first pad and a second pad, the first pad being disposed in a first region of the substrate, the second pad being disposed in a second region of the substrate, the first region being in an inner region of the substrate, the second region extending from the first region to a first edge of the substrate, the first pad and the second pad having a same first height, a first width of the first pad being greater than a second width of the second pad;
- a chip comprising a first bump and a second bump, the first bump and the second bump having a same third width;
- a first connector coupling the first bump to the first pad;
- and
- a second connector coupling the second bump to the second pad.
2 more elements
A device comprising:
- a chip comprising a first bump and a second bump, the first bump and the second bump having a same first width;
- a substrate comprising a first conductive feature and a second conductive feature, the first conductive feature being disposed in a first region of the substrate, the second conductive feature being disposed in a second region of the substrate, the first conductive feature having a second width and a first height, the second conductive feature having a third width and the first height;
- a first connector coupling the first bump to the first conductive feature;
- and
- a second connector coupling the second bump to the second conductive feature,
- wherein a ratio of the second width to the first width is different than a ratio of the third width to the first width.
3 more elements
A method comprising:
- providing a substrate comprising a first pad and a second pad, the first pad being disposed in a first region of the substrate, the second pad being disposed in a second region of the substrate, the first region being in an inner region of the substrate, the second region extending from the first region to a first edge of the substrate, the first pad and the second pad having a same first height, a first width of the first pad being greater than a second width of the second pad;
- providing a chip comprising a first bump and a second bump, the first bump and the second bump having a same third width;
- coupling the first bump to the first pad with a first connector;
- and
- coupling the second bump to the second pad with a second connector.
2 more elements
Dependencies are inferred from the claim text.