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US 2019/0096837 A1Published application
Method for preparing a semiconductor structure
AssigneeNanya Technology Corporation
InventorPo Chun LIN
Life of this patent
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Abstract
A method for preparing a semiconductor structure includes the steps of providing a substrate; forming a recess over the substrate; disposing a conductive layer over the substrate; and disposing a passivation over the substrate to at least partially cover the conductive layer.
Claims7
A method of manufacturing a semiconductor structure, comprising:
- providing a substrate;
- forming a recess over the substrate;
- disposing a conductive layer over the substrate;
- and
- disposing a passivation over the substrate to at least partially cover the conductive layer.
2 more elements
Dependencies are inferred from the claim text.