Pre-conductive array disposed on target circuit substrate and conductive structure array thereof

A pre-conductive array disposed on a target circuit substrate, comprising:

• a plurality of conductive electrode groups disposed on the target circuit substrate, wherein a first distance is provided between every two of the conductive electrode groups, and each of the conductive electrode groups comprises a conductive electrode;
• and
• at least a conductive particle disposed on each of the conductive electrodes of a part or all of the conductive electrode groups;
• wherein the conductive particle and the corresponding conductive electrode form a pre-conductive structure, and the pre-conductive structures form the pre-conductive array;
• wherein a first density is defined to represent a number of the conductive particles within a unit area of each of the pre-conductive structures, a second density is defined to represent a number of the conductive particles within a unit area between two of the pre-conductive structures, and the first density is greater than the second density.

A pre-conductive array disposed on a target circuit substrate, comprising:

• a plurality of pre-conductive structures disposed on the target circuit substrate, each of the pre-conductive structures comprising:
• a plurality of conductive electrode groups disposed on the target circuit substrate, wherein each of the pre-conductive structures comprises a first number of the conductive electrode groups, each of the conductive electrode groups comprises at least a pair of conductive electrodes, and each of the conductive electrode groups comprises a second number of the conductive electrodes;
• and
• at least a conductive particle disposed on each of the conductive electrodes of a part or all of the conductive electrode groups, wherein each of the pre-conductive structures comprises a third number of the conductive particles;
• wherein a first density is defined to represent a number of the conductive particles within a unit area of each of the pre-conductive structures, a second density is defined to represent a number of the conductive particles within a unit area between two of the pre-conductive structures, and the first density is greater than the second density.

A pre-conductive array disposed on a target circuit substrate, comprising:

• a plurality of pre-conductive structures disposed on the target circuit substrate, each of the pre-conductive structures comprising:
• a plurality of conductive electrode groups disposed on the target circuit substrate, wherein each of the pre-conductive structures comprises a first number of the conductive electrode groups, each of the conductive electrode groups comprises at least a conductive electrode, and each of the conductive electrode groups comprises a second number of the conductive electrodes;
• and
• at least a conductive particle disposed on each of the conductive electrodes of a part or all of the conductive electrode groups, wherein each of the pre-conductive structures comprises a third number of the conductive particles;
• wherein a first density is defined to represent a number of the conductive particles within a unit area of each of the pre-conductive structures, a second density is defined to represent a number of the conductive particles within a unit area between two of the pre-conductive structures, and the first density is greater than the second density.

A pre-conductive array disposed on a target circuit substrate, comprising:

• a plurality of pre-conductive structures disposed on the target circuit substrate, each of the pre-conductive structures comprising:
• a plurality of conductive electrode groups disposed on the target circuit substrate and distributed in a first array pattern, wherein each of the conductive electrode groups comprises at least a pair of conductive electrodes distributed in a second array pattern;
• and
• at least a conductive particle disposed on each of the conductive electrodes of a part or all of the conductive electrode groups, wherein the conductive particles are distributed in a third array pattern;
• wherein a first density is defined to represent a number of the conductive particles within a unit area of each of the pre-conductive structures, a second density is defined to represent a number of the conductive particles within a unit area between two of the pre-conductive structures, and the first density is greater than the second density.

A pre-conductive array disposed on a target circuit substrate, comprising:

• a plurality of pre-conductive structures disposed on the target circuit substrate, each of the pre-conductive structures comprising:
• a plurality of conductive electrode groups disposed on the target circuit substrate and distributed in a first array pattern, wherein each of the conductive electrode groups comprises at least a conductive electrode distributed in a second array pattern;
• and
• at least a conductive particle disposed on each of the conductive electrodes of a part or all of the conductive electrode groups, wherein the conductive particles are distributed in a third array pattern;
• wherein a first density is defined to represent a number of the conductive particles within a unit area of each of the pre-conductive structures, a second density is defined to represent a number of the conductive particles within a unit area between two of the pre-conductive structures, and the first density is greater than the second density.

A conductive structure array of a target circuit substrate, comprising:

• a pre-conductive array applied to the target circuit substrate;
• and
• array-type micro semiconductor structures disposed corresponding to a part or all of the pre-conductive array of the target circuit substrate, wherein each of the micro semiconductor structures has a pair of electrodes, and each of the electrodes of each of the micro semiconductor structures and the corresponding pre-conductive structure of the target circuit substrate together form a conductive structure;
• wherein a first density is defined to represent a number of conductive particles within a unit area of each of the conductive structures, a second density is defined to represent a number of the conductive particles within a unit area between two of the conductive structures, and the first density is greater than the second density.

A conductive structure array of a target circuit substrate, comprising:

• a pre-conductive array applied to the target circuit substrate;
• and
• array-type micro semiconductor structures disposed corresponding to a part or all of the pre-conductive array of the target circuit substrate, wherein each of the micro semiconductor structures has an electrode, and the electrode of each of the micro semiconductor structures and the corresponding pre-conductive structure of the target circuit substrate together form a conductive structure;
• wherein a first density is defined to represent a number of conductive particles within a unit area of each of the conductive structures, a second density is defined to represent a number of the conductive particles within a unit area between two of the conductive structures, and the first density is greater than the second density.