Integrated circuit packages

An integrated circuit (IC) structure, comprising:

• a die having a plurality of first contacts on a face;
• a dielectric layer in contact with the face of the die;
• and
• a first conductive pathway connecting to a first individual contact of the plurality of first contacts and extending diagonally relative to the face of the die through the dielectric layer.

A method of manufacturing an integrated circuit (IC) structure, comprising:

• forming a dielectric layer on a face of a die, wherein the face of the die includes a plurality of contacts;
• forming one or more tunnels through the dielectric layer extending diagonally, relative to the face of the die, from a top surface of the dielectric layer to an individual contact of the plurality of contacts;
• and
• filling the one or more tunnels with conductive material to form one or more conductive pathways.

A computing device, comprising:

• an integrated circuit (IC) assembly, comprising:
• a die having a plurality of contacts on a face;
• a dielectric material on the face of the die, wherein the dielectric material is in contact with the plurality of contacts and has an area greater than an area of the die;
• and
• a conductive pathway extending through the dielectric material having a first end and a second end, wherein the first end is electrically coupled to an individual contact of the plurality of contacts, and wherein the second end is at a top surface of the dielectric material and is positioned beyond the area of the die;
• and
• a circuit board, wherein the circuit board is electrically coupled to the die via the conductive pathway.