Structure and formation method of chip package with lid
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsShu-Shen YEH, Chin-Hua WANG, Kuang-Chun LEE, Po-Yao LIN, Shyue-Ter LEU, Shin-Puu JENG
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Abstract
Structures and formation methods of a chip package are provided. The chip package includes a substrate and a semiconductor die over the substrate. The chip package also includes a lid covering a top surface of the semiconductor die. The lid has multiple support structures, and the support structures are positioned at respective corner portions of the substrate. Multiple openings penetrate through the lid to expose a space containing the semiconductor die.
Claims20
A chip package, comprising:
- a substrate;
- a semiconductor die over the substrate;
- and
- a lid covering a top surface of the semiconductor die, wherein the lid has a plurality of support structures, the plurality of support structures are positioned at respective corner portions of the substrate, and a plurality of openings penetrate through the lid to expose a space containing the semiconductor die.
A chip package, comprising:
- a substrate;
- a semiconductor die over the substrate;
- and
- a lid covering a top surface of the semiconductor die, wherein the lid has a plurality of support structures, at least one of the support structures is bonded with a corner portion of the substrate, at least one opening is between two of the support structures, and the at least one opening penetrates through the lid to expose a space containing the semiconductor die.
A method for forming a chip package, comprising:
- disposing a semiconductor die over a substrate;
- and
- disposing a lid over the substrate to cover a top surface of the semiconductor die, wherein the lid has a plurality of support structures, the plurality of support structures are positioned at respective corner portions of the substrate, and a plurality of openings penetrate through the lid to expose a space containing the semiconductor die.
Dependencies are inferred from the claim text.