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US 2019/0096824 A1Published application
Fan-out semiconductor package
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsKang Heon HUR, Jong Man KIM, Kyung Ho LEE, Han KIM
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Abstract
A semiconductor package includes a wiring portion including an insulating layer, conductive patterns disposed on the insulating layer, and conductive vias penetrating through the insulating layer and connected to the conductive patterns, a semiconductor chip disposed on the wiring portion, an encapsulant disposed on the wiring portion and encapsulating at least a portion of the semiconductor chip, and a metal layer disposed on the semiconductor chip and the encapsulant and having a thickness of 10 μm to 70 μm.
Claims16
A semiconductor package comprising:
- a wiring portion including an insulating layer, conductive patterns disposed on the insulating layer, and conductive vias penetrating through the insulating layer and connected to the conductive patterns;
- a semiconductor chip disposed on the wiring portion;
- an encapsulant disposed on the wiring portion and encapsulating at least a portion of the semiconductor chip;
- and
- a metal layer disposed on the semiconductor chip and the encapsulant and having a thickness of 10 μm to 70 μm.
2 more elements
Dependencies are inferred from the claim text.