Semiconductor package device and method of manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsJen-Kuang FANG, Wen-Long LU
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Abstract
A semiconductor package device comprises an electronic component, a conductive bump and a first conductive layer. The electronic component has a top surface. The conductive bump is disposed on the top surface of the electronic component. The conductive bump includes a main body and a protruding portion. The first conductive layer covers a portion of the protruding portion. The first conductive layer has a first upper surface and a second upper surface. The first upper surface and the second upper surface are not coplanar.
Claims21
A semiconductor package device, comprising:
- an electronic component having a top surface;
- a conductive bump disposed on the top surface of the electronic component, the conductive bump comprising a main body and a protruding portion;
- and
- a first conductive layer covering a portion of the protruding portion, the first conductive layer having a first upper surface and a second upper surface, wherein the first upper surface and the second upper surface are not coplanar.
A semiconductor package device, comprising:
- an electronic component having a top surface;
- a conductive bump disposed on the top surface of the electronic component, the conductive bump comprising a main body and a protruding portion;
- and
- a first conductive layer covering a portion of the protruding portion, wherein the first conductive layer comprises a first portion conformal to the portion of the protruding portion of the conductive bump.
Dependencies are inferred from the claim text.