Compositions for gap coating and/or filling in or between electronic packages by capillary flow and methods for the use thereof

A conductive formulation comprising:

• a conductive filler, and
• a diluent;
• wherein said conductive formulation has:
• a viscosity in the range of about 1 up to about 20,000 centipoise at the operating temperature,
• a thixotropic index (TI) in the range of about 0.01 up to about 5 at the operating temperature,
• and
• a volume resistance and/or magnetic resistance effective for electromagnetic interference (EMI) shielding.

A method to fill a gap in an electronic package to achieve electromagnetic interference (EMI) shielding thereof, said method comprising:

• dispensing a conductive formulation according to any of the preceding claims at the open edge or along the gap under conditions suitable for capillary flow of said formulation, and
• subjecting said package to conditions suitable for capillary flow,
• optionally subjecting said formulation to conditions suitable to cure thermoset components thereof, and
• optionally removing any residual diluent therefrom.