Semiconductor packages and methods of forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsKuan-Lin Ho, Chin-Liang Chen, Chi-Yang Yu, Yu-Min Liang
Life of this patent
Estimating the term…
Abstract
Semiconductor packages and methods of forming the same are disclosed. The semiconductor package includes a plurality of chips, a first molding compound, a first redistribution structure, a second molding compound and a second redistribution structure. The first molding compound encapsulates the chips. The first redistribution structure is disposed over the plurality of chips and the first molding compound. The second molding compound surrounds the first molding compound. The second redistribution structure is disposed over the first redistribution structure, the first molding compound and the second molding compound.
Claims21
A semiconductor package, comprising:
- a plurality of chips, wherein one of the plurality of chips comprises a protection layer;
- a first molding compound, encapsulating the plurality of chips, and a material of the protection layer is different from a material of the first molding compound;
- a first redistribution structure, disposed over the plurality of chips and the first molding compound, wherein the first redistribution structure is in contact with the protection layer;
- a second molding compound, surrounding the first molding compound, wherein the second molding compound covers the first redistribution structure;
- and
- a second redistribution structure, disposed over the first redistribution structure, the first molding compound and the second molding compound.
A semiconductor package, comprising:
- a redistribution structure;
- a plurality of chips, disposed over the redistribution structure;
- a first molding compound, disposed over the redistribution structure and encapsulating the plurality of chips, wherein the first molding compound is not horizontally extended between active surfaces of the plurality of chips and the redistribution structure;
- a second molding compound, covering the redistribution structure and surrounding the first molding compound;
- and
- a conductive lid, covering the plurality of chips over the redistribution structure.
(canceled)
A method of forming a semiconductor package, comprising:
- providing a plurality of package units over a first carrier, wherein at least one of the plurality of package units comprises a plurality of chips encapsulated by a first molding compound and a first redistribution structure disposed over the plurality of chips and the first molding compound, wherein the first molding compound is not horizontally extended between active surfaces of the plurality of chips and the first redistribution structure;
- encapsulating the plurality of package units by a second molding compound;
- forming a second redistribution structure over the plurality of package units;
- and
- dicing the plurality of package units and the second redistribution structure thereon to form the semiconductor package, wherein the semiconductor package comprises the package unit, the second molding compound and a portion of the second redistribution structure.
Dependencies are inferred from the claim text.