Integrated fan-out package and method of fabricating the same

An integrated fan-out package, comprising:

• a die;
• an insulating encapsulation encapsulating the die;
• a plurality of conductive through vias in the form of a cup shape respectively disposed in a plurality of through holes in the insulating encapsulation;
• a dielectric material disposed over the conductive through vias and the insulating encapsulation, and extending in the through holes;
• a plurality of conductive terminals respectively disposed over bottoms of the conductive through vias;
• and
• a plurality of barrier layers respectively disposed between the bottoms of the conductive through vias and the conductive terminals, wherein a material of the barrier layers is different from a material of the conductive through vias and a material of the conductive terminals, wherein top surfaces of the barrier layers and a bottom surface of the insulating encapsulation are coplanar.

A method of fabricating an integrated fan-out package, the method comprising:

• mounting a die over a dielectric layer;
• forming an insulating encapsulation to encapsulate the die;
• forming a redistribution circuit structure over the insulating encapsulation, the redistribution circuit structure comprising a redistribution conductive layer, the redistribution conductive layer distributed in the insulating encapsulation and extending from a first surface of the insulating encapsulation to a second surface of the insulating encapsulation;
• patterning the dielectric layer to expose portions of the redistribution conductive layer at the second surface of the insulating encapsulation;
• forming a barrier layer over the redistribution conductive layer exposed by the second surface of the insulating encapsulation;
• and
• forming a conductive terminal over the barrier layer, wherein a material of the barrier layer is different from a material of the redistribution conductive layer and a material of the conductive terminal,
• wherein the forming the redistribution circuit structure comprises forming a conductive through via penetrating through the insulating encapsulation and a conductive layer over the conductive through via, the conductive layer partially covers the first surface of the insulating encapsulation, and the barrier layer is disposed between a bottom of the conductive through via and the conductive terminal.