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US 2019/0096797 A1Published application
Package structure and manufacturing method thereof
AssigneeNanya Technology Corporation
InventorPo-Chun LIN
Life of this patent
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Abstract
A package structure includes an interconnection layer; a passivation layer disposed on the interconnection layer, in which the interconnection layer and the passivation layer defined at least one opening; at least one elastic bump disposed on the interconnection layer, in which a portion of the elastic bump is embedded in the opening; and a conductive layer disposed on the elastic bump.
Claims10
A manufacturing method of a package structure, the manufacturing method comprising:
- forming an interconnection layer;
- forming a passivation layer on the interconnection layer;
- recessing the passivation layer to form at least one opening;
- forming at least one elastic bump in the opening, wherein a portion of the elastic bump is embedded in the opening;
- and
- forming a conductive layer on the elastic bump and the passivation layer.
3 more elements
A manufacturing method of a package structure, the manufacturing method comprising:
- forming an interconnection layer;
- recessing the interconnection layer to form at least one opening;
- forming a least one elastic bump in the opening, wherein a portion of the elastic bump is embedded in the opening;
- and
- forming a conductive layer on the elastic bump.
2 more elements
Dependencies are inferred from the claim text.