Dense Redistribution Layers in Semiconductor Packages and Methods of Forming the Same

A semiconductor package comprising:

• an integrated circuit die;
• an encapsulant disposed around the integrated circuit die;
• a through via extending through the encapsulant;
• and
• a first conductive line directly on the encapsulant and the through via;
• a first via directly on the first conductive line, a width of the first conductive line being greater than a width of the first via;
• a second conductive line directly on the encapsulant and the integrated circuit die;
• a second via directly on the second conductive line, a width of the second conductive line being greater than a width of the second via;
• and
• a dielectric layer, the dielectric layer having a first surface level with a first surface of the first conductive line and a second surface level with a first surface of the first conductive via.

A semiconductor package comprising:

• an integrated circuit die;
• an encapsulant disposed around the integrated circuit die;
• a through via extending through the encapsulant;
• and
• a first conductive structure on the encapsulant and the through via, wherien the first conductive structure comprises a seed layer and a conductive layer;
• a first via coupled to the first conductive structure;
• and
• a dielectric layer extending from a bottom of the seed layer to a top of the first via.