Tapeless leadframe package with underside resin and solder contact
AssigneeSTMicroelectronics S.r.l.
InventorJefferson Talledo
Life of this patent
Estimating the term…
Abstract
The present disclosure is directed to a semiconductor die on a tapeless leadframe and covered in encapsulant. The semiconductor package includes leads formed from the leadframe and electrically coupled to the semiconductor die, the leads being accessible through electrical contacts embedded in the encapsulant. Openings between the leads and the leadframe are formed from etching recesses from opposing sides of the leadframe. The resulting openings have non-uniform sidewalls. The leadframe is further electrically or thermally coupled to electrical contacts embedded in the encapsulant. The embedded electrical contacts forming a land grid array.
Claims20
A method, comprising:
- coupling a semiconductor die onto a first surface of a leadframe, the leadframe having a plurality of recesses on a second surface thereof that is opposite to the first surface;
- forming a discrete electrical contact in a first recess of the plurality of recesses, the discrete electrical contact having a first portion extending into the first recess and a second portion extending away from the first recess;
- covering the second surface of the leadframe and the discrete electrical contact with an encapsulant material;
- and
- exposing the discrete electrical contact from the encapsulant material by removing a portion of the encapsulant material.
A method of forming a leadframe package, comprising:
- etching a first plurality of recesses into a first side of a leadframe;
- forming a plurality of electrical contacts in a first group of the first plurality of recesses in the first side of the leadframe;
- applying a first molding to the first side of the leadframe, the first molding covering each of the plurality of electrical contacts and extending into a second group of the first plurality of recesses;
- forming openings in the leadframe by etching a second plurality of recesses into a second side of the leadframe, the second side of the leadframe opposite the first side of the leadframe, each of the second plurality of recesses overlapping one of the second group of the first plurality of recesses in the first side of the leadframe;
- coupling a die to a second side of the leadframe,
- coupling a subset of the plurality of electrical contacts to the die;
- and
- applying a second molding to the second side of the leadframe, the second molding contacting the first molding through the openings in the leadframe.
A method, comprising:
- forming a first recess and a second recess on a first surface of a carrier platform;
- forming a conductive material within the first recess;
- forming an encapsulation material over the first surface covering the conductive material and the second recess while keeping a second surface of the carrier platform substantially free of the encapsulation material;
- removing partially the encapsulation material formed over the first surface such that the conductive material formed within the first recess is exposed;
- and
- forming the encapsulation material over the second surface of the carrier platform after the removing partially the encapsulation material formed over the first surface.
Dependencies are inferred from the claim text.