Semiconductor packages that include a heat pipe for exhausting heat from one or more ends of the package
AssigneeSamsung Electronics Co., Ltd.
InventorsJaeHong PARK, Hanhong LEE, Sungwoo JOO, Woon-young BAEK
Life of this patent
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Abstract
A semiconductor package includes a package substrate including a fastening section at one end and a connecting terminal section at an opposite end, at least one semiconductor device mounted on the package substrate, at least one heat pipe on the at least one semiconductor device, and a lid on the at least one semiconductor device and the at least one heat pipe. At least one end of the heat pipe is between the at least one semiconductor device and either the fastening section or the connecting terminal section.
Claims17
A semiconductor package, comprising:
- a package substrate;
- at least one semiconductor device mounted on the package substrate;
- at least one heat pipe on the at least one semiconductor device;
- and
- a lid on the at least one semiconductor device and the at least one heat pipe,
- wherein the at least one heat pipe comprises:
- a first extension that runs across the at least one semiconductor device and extends in a first direction;
- and
- a second extension that extends from the first extension in a second direction crossing the first direction, the second extension being between one end of the package substrate and one end of the semiconductor device in plan view.
A semiconductor package, comprising:
- a package substrate comprising a fastening section and a connecting terminal section at opposite ends thereof, respectively;
- at least one semiconductor device mounted on the package substrate;
- at least one heat pipe on the at least one semiconductor device;
- and
- a lid on the at least one semiconductor device and the at least one heat pipe,
- wherein the at least one heat pipe comprises:
- a first extension that runs across the at least one semiconductor device and extends in a first direction;
- and
- a second extension that extends from the first extension in a second direction crossing the first direction,
- wherein the second extension is adjacent to either the fastening section or the connecting terminal section.
A semiconductor package, comprising:
- a package substrate having first and second external interface sections at opposing ends, respectively;
- a semiconductor device mounted on the package substrate;
- a heat pipe on the semiconductor device;
- and
- a lid on the heat pipe and the semiconductor device;
- wherein the heat pipe comprises:
- first and second parallel pipe sections extending between the first and second external interface sections of the package substrate;
- and
- a third pipe section connected to at least one of the first and second parallel pipe sections, the third pipe section being between the semiconductor device and the first external interface section and being nonparallel with the at least one of the first and second parallel pipe sections.
Dependencies are inferred from the claim text.