System and method to enhance solder joint reliability
AssigneeWestern Digital Technologies, Inc.
InventorsLee Kong Yu, Sungjun Im, Chun Sean Lau, Yoong Tatt Chin, Paramjeet Singh Gill, Weng-Hong Teh
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Abstract
A reliability cover that is disposed over at least one of an integrated circuit package and a Si die of the integrated circuit package is disclosed. The integrated circuit package is mountable to a printed circuit board via a plurality of solder balls. The reliability cover is configured to reduce a difference in a coefficient of thermal expansion between the integrated circuit package and the printed circuit board, and between the Si die and a substrate of the integrated circuit package by a threshold value.
Claims20
A system comprising:
- a reliability cover disposed over at least one of an integrated circuit package and a Si die of the integrated circuit package, wherein the integrated circuit package is mountable to a printed circuit board via a plurality of solder balls, and
- wherein the reliability cover is configured to reduce a difference in a coefficient of thermal expansion between the integrated circuit package and the printed circuit board, and between the Si die and a substrate of the integrated circuit package by a threshold value.
A method comprising:
- identifying a failure profile of solder joints formed between a first component and a level of interconnects and between the level of interconnects and a second component;
- and
- disposing a reliability cover over one or more surfaces of at least one of the first component and the second component based upon the failure profile.
A system comprising:
- a printed circuit board having a first coefficient of thermal expansion;
- an integrated circuit package configured to be mounted to the printed circuit board and having a second coefficient of thermal expansion;
- and
- a reliability cover disposed over at least a portion of the integrated circuit package and at least a portion of a Si die within the integrated circuit package, wherein the reliability cover is configured to reduce a difference between the first coefficient of thermal expansion and the second coefficient of thermal expansion by a threshold value.
Dependencies are inferred from the claim text.