Substrate processing method, substrate processing apparatus and recording medium
AssigneeTokyo Electron Limited
InventorsAkiko Kai, Kouichirou Tanaka, Hiroshi Ichinomiya, Masahiro Fukuda
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AssigneeTokyo Electron Limited
InventorsAkiko Kai, Kouichirou Tanaka, Hiroshi Ichinomiya, Masahiro Fukuda
Estimating the term…
When performing a liquid processing on a substrate W being rotated and removing a processing liquid by a cleaning liquid, a cleaning liquid nozzle 421 configured to discharge a cleaning liquid slantly with respect to a surface of the substrate W toward a downstream side of a rotational direction of the substrate W and a gas nozzle 411 configured to discharge a gas toward a position adjacent to a central portion side of the substrate W when viewed from a liquid arrival position R of the cleaning liquid are moved from the central portion side toward a peripheral portion side. A rotation number of the substrate is varied such that rotation number in a period during which the liquid arrival position R moves in the second region becomes smaller than a maximum rotation number in a period during which the liquid arrival position moves in the first region.
A substrate processing method of performing a liquid processing by supplying a processing liquid onto a substrate horizontally held and rotated around a central axis thereof and removing the processing liquid by supplying a cleaning liquid onto the substrate, the substrate processing method comprising:
A substrate processing apparatus configured to perform a liquid processing by supplying a processing liquid onto a substrate, the substrate processing apparatus comprising:
Dependencies are inferred from the claim text.