Substrate treatment method and substrate treatment apparatus

A substrate treatment apparatus for treating a surface of a substrate, comprising:

• a rotation holding unit that rotates a substrate while holding it horizontally;
• a first treatment liquid supplying unit that supplies a first treatment liquid to a surface of said substrate held by said rotation holding unit;
• a modification treatment liquid supplying unit that supplies a modification treatment liquid for changing surface chemical properties of said substrate to a surface of said substrate held by said rotation holding unit to be able to form a liquid film of said modification treatment liquid on said surface;
• a heating unit that heats said substrate held by said rotation holding unit;
• and
• a control unit that controls said heating unit so as to increase an amount of heat per unit time to be applied to said substrate by said heating unit when said modification treatment liquid supplying unit supplies said modification treatment liquid to said substrate more than an amount of heat to be applied to said substrate by said heating unit when said first treatment liquid supplying unit supplies the first treatment liquid to said substrate.